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                Group Structure

                • ASM Pacific Technology
                    • Wire bonders
                    • Die bonders
                    • Encapsulation solutions
                    • Test handlers
                    • Clip bonders,
                    • CIS ?equipment
                    • TCB bonders
                    • Flip chip bonders
                    • Mold Under Fill (MUF)
                    • Panel molding
                    • Laser grooving and dicing
                    • Leadframes
                    • Advanced packaging materials (molded interconnect substrates)
                    • Assembly line solutions
                    • DEK printing systems
                    • SIPLACE placement systems
                    • ASM smart factory tools & services
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